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Micro Laser Sintering (MLS) Technology Builds Durable Microstructures

Everyone who has seen the firing of pottery and other ceramic objects, processes used for centuries, understands what micro laser sintering is all about. English geologists first used the term “sintering” in 1780 to describe bonding of mineral particles. But today, an updated version of the process is finding applications in nearly all fields of industry. According to Dr. Hans J. Langer, founder and CEO of EOS “demand for very small parts which are difficult to manufacturer using conventional processes is rising tremendously.” What is truly amazing is that evermore complex objects with moving and connected parts can be manufactured as one piece: see video below.

Micro laser sintering” is an emerging technology whereby products are layered at a rate of less than or equal to 5 microns (µ), focused diameters of less than or equal to 30 microns (µ) with powder particle sizes of less than or equal to 5 microns (µ). Micro Laser Sintering (MLS) uses a laser to melt these extremely fine grained metal powders to form a layer by layer small-scale object, as small as nano-scale metal components, This process is also called “industrial 3-D printing.

3D-Micromac AG and Laonger’s EOS Gmbh recently merged to form 3D Microprint to provide laser micro-machining systems. The company is working toward commercialization of MLS technology. The technology will allow for the creation of miniature metal and ceramic components.

A company called Sintermask GmbH provides a powder-based technology that fully melts metal or ceramic powders directly forming durable full parts. Another company, Trumpsystem Precision Machinery of China provides lasers sintering systems for fabricating plastic parts. And of course the Japanese have developed their own laser sintering technology.

Laser sintering generally takes place at high temperatures at which sintering eliminates biological materials such as proteins or living cells while melting the materials needed to building product layer by layer.

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